Tantalum Sputtering Target - Disc
Kev piav qhia
Tantalum sputtering lub hom phiaj yog tsuas yog siv nyob rau hauv semiconductor kev lag luam thiab optical txheej kev lag luam.Peb tsim ntau yam tshwj xeeb ntawm tantalum sputtering lub hom phiaj raws li qhov kev thov ntawm cov neeg siv khoom los ntawm kev lag luam semiconductor thiab kev lag luam kho qhov muag los ntawm lub tshuab nqus tsev EB rauv smelting txoj kev.Los ntawm kev ceev faj ntawm cov txheej txheem dov tshwj xeeb, los ntawm kev kho mob nyuaj thiab qhov tseeb annealing kub thiab lub sijhawm, peb tsim qhov sib txawv ntawm tantalum sputtering lub hom phiaj xws li disc hom phiaj, lub hom phiaj lub hom phiaj thiab lub hom phiaj teb.Ntxiv mus, peb lav lub tantalum purity nyob nruab nrab ntawm 99.95% mus rau 99.99% los yog siab dua;cov nplej loj yog qis dua 100um, flatness qis dua 0.2mm thiab Nto Roughness qis dua Ra.1.6μm.Qhov loj tuaj yeem raug kho raws li cov neeg siv khoom xav tau.Peb tswj peb cov khoom zoo los ntawm cov khoom siv raw kom txog rau tag nrho cov kab ntau lawm thiab thaum kawg xa mus rau peb cov neeg siv khoom kom paub tseeb tias koj yuav peb cov khoom nrog ruaj khov thiab zoo tib yam txhua ntau.
Peb tab tom sim peb qhov zoo tshaj plaws los tsim peb cov tswv yim, txhim kho cov khoom zoo, nce cov khoom siv, txo tus nqi, txhim kho peb cov kev pab cuam los muab peb cov neeg siv khoom nrog cov khoom zoo dua tab sis qis dua cov nqi yuav khoom.Thaum koj xaiv peb, koj yuav tau txais peb cov khoom zoo ruaj khov, tus nqi sib tw ntau dua li lwm tus neeg muag khoom thiab peb cov kev pabcuam raws sijhawm, muaj txiaj ntsig zoo.
Peb tsim R05200, R05400 lub hom phiaj uas ua tau raws li ASTM B708 tus qauv thiab peb tuaj yeem ua lub hom phiaj raws li koj cov duab kos.Ua kom zoo ntawm peb cov khoom zoo tantalum ingots, cov cuab yeej siv siab heev, cov thev naus laus zis tshiab, pab pawg tshaj lij, peb tau kho koj cov hom phiaj sputtering.Koj tuaj yeem qhia peb txhua yam koj xav tau thiab peb mob siab rau hauv kev tsim khoom raws li koj xav tau.
Hom thiab Loj:
ASTM B708 Txheem Tantalum Sputtering Target, 99.95% 3N5 - 99.99% 4N Purity, Disc Target
Chemical Compositions:
Kev Ntsuas Ntsuas: Ta 99.95% 3N5 - 99.99% (4N)
Hlau impurities, ppm max los ntawm qhov hnyav
Element | Al | Au | Ag | Bi | B | Ca | Cl | Cd | Co | Cr | Cu | Fe |
Cov ntsiab lus | 0.2 | 1.0 | 1.0 | 1.0 | 0.1 | 0.1 | 1.0 | 1.0 | 0.05 Nws | 0.25 | 0.75 ib | 0.4 |
Element | Ga | Ge | Hf | K | Li | Mg | Na | Mo | Mn | Nb | Ni | P |
Cov ntsiab lus | 1.0 | 1.0 | 1.0 | 0.05 Nws | 0.1 | 0.1 | 0.1 | 5.0 | 0.1 | 75 | 0.25 | 1.0 |
Element | Pb | S | Si | Sn | Th | Ti | V | W | Zn | Zr | Y | U |
Cov ntsiab lus | 1.0 | 0.2 | 0.2 | 0.1 | 0.0 | 1.0 | 0.2 | 70.0 ua | 1.0 | 0.2 | 1.0 | 0.005 ib |
Non-Metallic impurities, ppm max los ntawm qhov hnyav
Element | N | H | O | C |
Cov ntsiab lus | 100 | 15 | 150 | 100 |
Balance: Tantalum
Grain Size: Qhov loj me <100μm Grain Size
Lwm cov qoob loo loj muaj raws li qhov kev thov
Flatness: ≤0.2 hli
Nto Roughness: <Ra 1.6μm
Nto: Polished
Daim ntawv thov
Txheej cov ntaub ntawv rau semiconductors, optics